Process for the selective additive correction of voids in copyin

Details Process for the selective additive correction of voids in copyin Process for the selective additive correction of voids in copyin

1988-05-25

1989-05-30

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

048348449

ABSTRACT:
A process is disclosed for the selective additive correction of voids in copying layers, in which electrically conductive aqueous solutions of an organic compound are deposited in the void, with direct current connection between conductive substrate and at least one electrode, and with a current density in the range from 0.01 to 100 A/dm.sup.2. The process is preferably carried out using organic polymers with substrates composed of metal, for example, aluminum, in grained and anodized form.

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patent: 4086853 (1978-05-01), Figov et al.
patent: 4376814 (1983-03-01), Walls
patent: 4383897 (1983-05-01), Gillich et al.
patent: 4519876 (1985-05-01), Lee et al.

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