Process for fabrication of a semiconductor structure and contact

Details Process for fabrication of a semiconductor structure and contact Process for fabrication of a semiconductor structure and contact

1991-12-18

1993-02-16

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 437189, 437190, 156644, H01L 2144

Patent

active

051871211

ABSTRACT:
Self-aligning process for fabricating a semiconductor structure and stud therefor on a semiconductor substrate comprises depositing a first material onto the substrate, depositing a second material onto the first material, removing excess portions of second material so as to form openings through the second material exposing excess portions of first material, whereby a selected portion of second material is retained and forms a sacrificial element, removing the excess portions of first material selectively to the substrate so as to extend the openings through the first material to the substrate, whereby a selected portion of first material is retained and forms the semiconductor structure, filling the openings with an insulating material, removing the sacrificial element selectively to the insulating material and the semiconductor structure for forming a contact window opening for allowing access to the semiconductor structure, and filling the contact window opening with stud material so as to contact the semiconductor structure for forming the stud.

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