High dielectric constant flexible polyimide film and process of

Details High dielectric constant flexible polyimide film and process of High dielectric constant flexible polyimide film and process of

1998-12-29

2000-12-12

Nakarani, D. S.

Stock material or miscellaneous articles

Composite

Of polyimide

428355R, 428355N, B32B 2706

Patent

active

061596116

ABSTRACT:
A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

REFERENCES:
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5252700 (1993-10-01), Okikawa et al.
patent: 5298331 (1994-03-01), Kanakarajan et al.
Database WPI, Section Ch, Week 8041, Derwent Publications, Ltd, London, GB, Class A85, AN 80-72495C, Aug. 29, 1980.

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