Method of producing a scribelined layout structure for plastic e

Details Method of producing a scribelined layout structure for plastic e Method of producing a scribelined layout structure for plastic e

1992-12-15

1994-08-09

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Dividing work to form plural articles

264265, 26427217, 264274, B29C 5914, B29C 4514

Patent

active

053364562

ABSTRACT:
A method of producing surface features having topological variances in the scribeline areas of a wafer adjacent to the dies. Surface features are used to reduce fracturing of molding compound and to prevent movement of the molding compound with respect to the surface of a die in a plastic encapsulated integrated circuit.

REFERENCES:
patent: 3533896 (1970-10-01), Hartig
patent: 4224101 (1980-09-01), Tijburg et al.
patent: 4725561 (1988-02-01), Haond et al.
patent: 4904617 (1990-02-01), Muschke
patent: 4929300 (1990-05-01), Wegleiter
patent: 4984358 (1991-01-01), Nelson
patent: 5017512 (1991-05-01), Takagi
patent: 5024970 (1991-06-01), Mori

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