Semiconductor package, leadframe, and manufacturing method there

Details Semiconductor package, leadframe, and manufacturing method there Semiconductor package, leadframe, and manufacturing method there

1998-08-25

1999-11-02

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 174252, 257675, 257676, 257684, 257692, 257713, 257722, 361707, 361723, 361720, 361813, H05K 720

Patent

active

059782161

ABSTRACT:
A semiconductor package comprises a semiconductor chip having bonding pads in the center area of surface thereof; a plurality of leads disposed on and attached to the upper surface of the chip by an attaching means. The attaching means covers all but the bonding pads of the chip. The leads have a bonding tip which is disposed on the side thereof and electrically connected to the bonding pads by bonding wires, and are arranged horizontally along the surface of the chip thereby providing large contact areas to the chip. A molding compound hermetically encloses the chip and the attaching means, and exposes the leads. The semicoductor package can be used in combination with an electrical circuit board having improved heat dissipation capability. The electrical circuit board includes a substrate comprised of a dielectric material, a circuit wiring formed on the substrate, and a plurality of heat dissipation pins disposed on the substrate in a pattern corresponding to leads of the semiconductor package. The heat dissipation pins electrically connect the leads to the circuit wiring, and in conjunction with air flow in a space between the semiconductor package and the circuit substrate, help to dissipate heat. An improved mold for forming the semiconductor package is also disclosed, which mold is adapted to ensure that molding compound encloses all portions of the semiconductor chip except for portions of the leads.

REFERENCES:
patent: 4254447 (1981-03-01), Grittir
patent: 4677526 (1987-06-01), Muehling
patent: 4873615 (1989-10-01), Grabbe
patent: 5214563 (1993-05-01), Ester
patent: 5291372 (1994-03-01), Matsumoto
patent: 5786986 (1998-07-01), Bregman et al.

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