Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1994-06-16
1995-08-22
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257783, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054443016
ABSTRACT:
A plastic semiconductor package and a method for producing the same. The package comprises a plurality of chip signal transmitting leads protruded from a semiconductor chip and functioning as electrical passage, a plurality of polyimide tapes each attached to the corresponding lead and having the same width as that of the lead, a plurality of insulating double-sided tapes each attached to a side of an upper surface of the corresponding lead for attaching the lead to the semiconductor chip, a plurality of conductive bumps each disposed to the other side of the upper surface of the corresponding lead for electrically connecting the lead to the semiconductor chip, and mold resin enveloping a predetermined area including the semiconductor chip and the leads. Since the package does not have metal wire, it is possible to reduce deterioration of a package due to wire-bonding, since the method of the invention eliminates a trimming/forming step to simplify its process.
REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4974057 (1990-11-01), Tazima
patent: 5283446 (1994-02-01), Tanisawa
IBM Technical Disclosure Bulletin, vol. 33 No. 7 Dec. 1990, "Direct Chip Bonding for LCD", p. 213.
IBM Technical Disclosure Bulletin, vol. 25 No. 4 Sep. 1982; "Photo-Defined Lamination for Chip Bonding", C. Edwards, Paper 1952/53.
Cha Gi B.
Song Chi J.
Clark Jhihan
Crane Sara W.
Goldstar Electron Co. Ltd.
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