Apparatus for stiffening a circuit board

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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  [ 5.00 ] – superior Voters 1   Comments 1

Details

2281801, 361399, 361419, 269903, B23K 108, B23K 3704

Patent

active

051863774

ABSTRACT:
An apparatus for stiffening a circuit board during soldering, assembly, and repair/rework, which includes an elongated crossmember having two opposing ends, an outer support leg extending downward from each crossmember end to form a bridge support with the crossmember and a central support leg extending downward from a central portion of the crossmember. A central portion of the circuit board is attached to the central support member to prevent the circuit board from softening and sagging when exposed to the heat from soldering.

REFERENCES:
patent: 2746062 (1956-05-01), Waltz
patent: 3604609 (1971-09-01), Walls
patent: 3729810 (1973-05-01), Piechocki
patent: 4175734 (1979-11-01), Williams
patent: 4411054 (1983-10-01), Zeilenga
patent: 4588177 (1986-05-01), White
patent: 4595185 (1986-06-01), Kitagawa
patent: 4602730 (1986-07-01), Murakami et al.
patent: 4769083 (1988-09-01), Tiritilli
patent: 4913334 (1990-04-01), Kondo
IBM Tech. Dis. Bull. "Universal Wave Soldering Support Bridge", Exum. vol. 26, No. 5 Oct. 1983, p. 1983.

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Donald K

This patent provides the support necessary to reflow solder complex, high density, double sided, high layer count, multiple layer printed circuit assemblies. It is used commonly in the production of MRI image generation PCBs.

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