Process for slicing boules of single crystal material

Details Process for slicing boules of single crystal material Process for slicing boules of single crystal material

1977-06-03

1978-04-18

Whitehead, Harold D.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51 73R, 51327, 125 13R, B24B 102

Patent

active

040843548

ABSTRACT:
A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.

REFERENCES:
patent: 3039235 (1962-06-01), Heinrich
patent: 3626644 (1971-12-01), Cupler
patent: 3662733 (1972-05-01), Okamoto

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