Epoxy resin compositions and semiconductor devices encapsulated

Details Epoxy resin compositions and semiconductor devices encapsulated Epoxy resin compositions and semiconductor devices encapsulated

1994-01-27

1995-05-23

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525481, 525482, 525534, 528 97, 257793, C08L 6300

Patent

active

054182662

ABSTRACT:
An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

REFERENCES:
patent: 3275708 (1966-09-01), Bylsma
patent: 3384618 (1968-05-01), Imoto et al.
patent: 4551508 (1985-11-01), Urasaki
patent: 4859722 (1989-08-01), Shiobara et al.
patent: 4877822 (1989-10-01), Itoh et al.
patent: 5068293 (1991-11-01), Kaji et al.
patent: 5155202 (1992-10-01), Morita et al.
patent: 5190995 (1993-03-01), Shiobara et al.
patent: 5298548 (1994-03-01), Shiobara et al.
English language translation of Japanese Kokai 63-251419 (Oct. 18, 1988).

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