Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1992-07-17
1994-08-09
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156626, 156646, 156662, 252 793, 134 3, 134 991, 1341021, H01L 2100
Patent
active
053363566
ABSTRACT:
In an apparatus for treating the surface of a semiconductor substrate, hydrogen fluoride is dissolved in a nonaqueous solvent, ionizing anhydrous hydrogen fluoride, and the solution is vaporized. The vapor of the solution is introduced onto the surface of the semiconductor in a reaction chamber to treat this surface. The semiconductor substrate can be subjected to treatments, such as cleaning and etching, without producing reactions products on the surface.
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Novak et al, "The Dry Etching Of Oxides Using Anhydrous HF", Extended Abstracts of the 22nd (1990 International) Conference on Solid State Devices and Materials, Sendai, 1990, pp. 1091-1093.
Ban Cozy
Fukumoto Takaaki
Ohmori Toshiaki
Dang Thi
Mitsubishi Denki & Kabushiki Kaisha
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