Method and apparatus for cleaning and separating wafers bonded t

Details Method and apparatus for cleaning and separating wafers bonded t Method and apparatus for cleaning and separating wafers bonded t

1997-06-04

1999-11-02

Warden, Jill

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438973, 438974, H01L 2168

Patent

active

059769548

ABSTRACT:
The present invention relates to a method of cleaning wafers bonded on a fixing member in the form of an ingot, and then sliced by a wire saw from a direction perpendicular to the longitudinal dimension to form a row of wafers. The method includes: a cleaning process for cleaning the wafers bonded on the fixing member in the form of the row of wafers (workpiece W) by a cleaning mechanism; and a separating process includes: a softening step for softening an adhesive in a softening vessel; a first moving step for turning and moving a wafer in a planar direction using an end point of the glued portion of the wafer and the fixing member as the fulcrum; and a second moving step for further moving the wafer in a planar direction by a suction-cup rotary actuator to thereby bring the wafer out of the region of the row of wafers.

REFERENCES:
patent: 3478418 (1969-11-01), Pomante
patent: 4664739 (1987-05-01), Aurichio
patent: 4897141 (1990-01-01), Girard
patent: 4904610 (1990-02-01), Shyr
patent: 5071792 (1991-12-01), Van Vonno et al.
patent: 5362681 (1994-11-01), Roberts, Jr. et al.
patent: 5667423 (1997-09-01), Itoi

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