Thermal stencil plate making method

Printing – Stenciling – Stencils

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1011284, 40012013, 347171, B41C 1055

Patent

active

054171563

ABSTRACT:
A thermal stencil plate making method, by which a perforation image is formed on a thermal stencil original sheet comprising a thermoplastic resin film and a porous support laminated on each other or a thermal stencil original sheet composed substantially only of a thermoplastic resin film by applying thermal energy to the thermal stencil original sheet by means of a thermal head, is characterized in that a distance between heating elements in the thermal head: d (.mu.m) and a thickness of a heating element protection layer: T (.mu.m) satisfy the following condition of Equation (1) and that a secondary scan direction heating element spacing between heating elements in the thermal head: D (.mu.m) and the thickness of the heating element protection layer: T (.mu.m) satisfy the following condition of Equation (2):

REFERENCES:
patent: 5216951 (1993-06-01), Yokoyama et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal stencil plate making method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal stencil plate making method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal stencil plate making method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2133873

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.