Surface-mounted semiconductor package and its manufacturing meth

Details Surface-mounted semiconductor package and its manufacturing meth Surface-mounted semiconductor package and its manufacturing meth

1996-12-05

1999-03-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361771, 361783, 257704, 257729, 174 524, 174255, H01L 2312, H05K 503

Patent

active

058868763

ABSTRACT:
The semiconductor package contains the substrate with a stacked structure; the semiconductor device mounted on the top of the substrate and provided with the electrode pads; the input/output terminals on the bottom of the substrate, which connects the semiconductor package to the printed circuit board; and the conductive tubes going through the substrate, which connects the input/output terminals and the electrode pads. The surface-mounted semiconductor package has the protecting device on its sides. The protect device prevents water and the like from infiltrating the edges of the substrate, and additionally avoid a crack of the substrate due to expansion of the water. Furthermore, the protecting device has the pairs of lands on both sides of the substrate, which fasten the edges of the substrate.

REFERENCES:
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patent: 5006667 (1991-04-01), Lonka
patent: 5031025 (1991-07-01), Braun et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5642262 (1997-06-01), Terrill et al.
patent: 5686172 (1997-11-01), Ohya et al.

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