Multi-density ceramic structure and process thereof

Details Multi-density ceramic structure and process thereof Multi-density ceramic structure and process thereof

1997-10-14

1999-11-02

Turner, Archene

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156297, 1563063, 1563082, 156325, 264642, 264643, 427 96, 427123, 4271261, 4271263, B32B 3100

Patent

active

059762861

ABSTRACT:
The present invention relates generally to a new multi-density ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of thicker green sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin punched green sheets were tacked/bonded to thicker punched and screened green sheets to form a sub-structure which had excellent stability in screening and enabled further processing.

REFERENCES:
patent: 5089455 (1992-02-01), Ketcham et al.
patent: 5176772 (1993-01-01), Ohtaki
patent: 5232765 (1993-08-01), Yano et al.
patent: 5300163 (1994-04-01), Ohtaki
patent: 5368667 (1994-11-01), Minh et al.
patent: 5480503 (1996-01-01), Casey et al.
patent: 5601672 (1997-02-01), Casey et al.

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