Circuit module having stacked circuit boards

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361748, 361760, 361767, 361813, 174 521, 174 522, 174257, 257686, 257700, H01R 2368

Patent

active

053093267

ABSTRACT:
A circuit module has a first circuit board, an IC chip mounted on the first circuit board, an electrode of the IC chip being connected to a wiring pattern of the first circuit board by a metal wire and the IC chip and the metal wire being coated with resin, and a second circuit board on which at least one unit of the first circuit board and the IC chip is mounted. The first circuit board is a double-side wired circuit board and the second circuit board is a single-side wired circuit board.

REFERENCES:
IBM Technical Disclosure Bulletin, Wadhwa, Low-cost circuit packaging, Jul. 1979, vol. 22, No. 2, p. 522.

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