High density para-aramid papers

Details High density para-aramid papers High density para-aramid papers

1986-03-13

1987-10-06

Pertilla, Theodore E.

Stock material or miscellaneous articles

Composite

Of polyamide

162146, 1621573, 428413, 428418, 428421, 4284235, 4284251, 428458, 428463, 4284763, 4285375, 428607, 428626, 428637, B32B 2734, D21F 1100

Patent

active

046982671

ABSTRACT:
High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

REFERENCES:
patent: 3756089 (1973-09-01), Gross
patent: 4035694 (1977-07-01), Barton et al.
Research Disclosure, No. 188, Item No. 18823, p. 674 (12/79).
Research Disclosure, No. 190, Item 19037, p. 74 (2/80).
IBM Technical Disclosure Bulletin, vol. 20, No. 2, p. 555 (7/77).

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