Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-04-15
1999-03-23
Arbee, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
2281805, 228199, 257777, H01R 900
Patent
active
058843981
ABSTRACT:
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
REFERENCES:
patent: 4585727 (1986-04-01), Reams
patent: 4955523 (1990-09-01), Carlomagno et al.
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5476211 (1995-12-01), Khandros
IBM Technical Disclosure Bull vol. 15, No. 11 (Apr. 1973) pp. 3428-3429 by Best et al.
Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Arbee Carl J.
Form Factor, Inc.
Larwood David
Linden Gerald
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