Apparatus for forming leads of semiconductor devices

Details Apparatus for forming leads of semiconductor devices Apparatus for forming leads of semiconductor devices

1988-12-15

1989-12-12

Goldberg, Howard N.

Metal working

Plural diverse manufacturing apparatus including means for...

Separate tool stations for selective or successive operation...

29827, 174 526, 437220, B23P 2300

Patent

active

048858374

ABSTRACT:
An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.

REFERENCES:
patent: 3899305 (1975-08-01), Hilgers et al.
patent: 3981074 (1976-09-01), Yamamoto et al.
patent: 4592131 (1986-06-01), Deie
patent: 4627159 (1986-12-01), Waldner

Affiliated with

Also associated with

Rating

Apparatus for forming leads of semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming leads of semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming leads of semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2114393