Method and apparatus for through hole substrate printing

Details Method and apparatus for through hole substrate printing Method and apparatus for through hole substrate printing

1992-08-07

1994-05-03

Chin, Peter

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118500, 118 50, 427294, 101126, B05D 512

Patent

active

053086457

ABSTRACT:
Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.

REFERENCES:
patent: 3993018 (1976-11-01), Kranik et al.
patent: 4040352 (1977-08-01), Curti
patent: 4971676 (1990-11-01), Doue et al.
patent: 5080929 (1992-01-01), Zachman et al.

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