Manufacturing method for thin semiconductor device assemblies

Details Manufacturing method for thin semiconductor device assemblies Manufacturing method for thin semiconductor device assemblies

1991-05-10

1993-03-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437927, 29841, H01L 2152, H01L 2156, H01L 2158

Patent

active

051926822

ABSTRACT:
A manufacturing method for a thin semiconductor device assembly includes forming an internal frame for positioning an IC module within an external frame that forms the periphery of the thin semiconductor device assembly, positioning the IC module in the internal frame so that an electrode terminal surface of the IC module is exposed, and fixing the IC module in place by filling the external and internal frames with resin.

REFERENCES:
patent: 4746392 (1988-05-01), Hoppe
patent: 4974120 (1990-11-01), Kodai et al.
patent: 5057460 (1991-10-01), Rose
patent: 5079673 (1992-01-01), Kodai et al.

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