Method of manufacturing inversion type IC's and IC module using

Details Method of manufacturing inversion type IC's and IC module using Method of manufacturing inversion type IC's and IC module using

1992-10-02

1994-04-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361744, 361792, 361807, 174 524, 174255, H05K 702

Patent

active

053031202

ABSTRACT:
A method of manufacturing inversion ICs includes the steps of connecting a first electrode pad group of a semiconductor chip to a second lead group via wires, connecting a second electrode pad group of the semiconductor chip to a first lead group via wires, sealing the semiconductor chip, the first and second lead groups, and the wires in a resin so that the outer lead portions of the leads are exposed, and bending the outer lead portions of the leads toward the bottom surface of the semiconductor chip. An IC module includes a mounting substrate, a standard IC mounted on the top surface of the mounting substrate, an inversion IC mounted on the bottom surface of the mounting substrate so that the leads providing connections to the same functions in the standard and inversion ICs are at the same point on opposite sides of the mounting substrate, and a plurality of connecting members on the mounting substrate, electrically connecting the opposed leads of the standard IC and the leads of the inversion IC together.

REFERENCES:
patent: 4937656 (1990-06-01), Kohara
patent: 4994896 (1991-02-01), Uemura et al.
patent: 5061990 (1991-10-01), Arakawa et al.
Proceedings of the Electronic Components Conference, Los Angeles, Ca., May 9-11, 1988, IEEE, N.Y., U.S., pp. 552-557; W. C. Ward: "Volume Production of Unique Plastic . . . Techniques".

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