Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-03-15
1997-09-16
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29833, 29852, 427 97, H05K 302, H05K 310, H05K 342
Patent
active
056667221
ABSTRACT:
A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.
REFERENCES:
patent: 4651417 (1987-03-01), Schumacher, III et al.
patent: 4943346 (1990-07-01), Mattelin
patent: 5245751 (1993-09-01), Locke et al.
patent: 5361491 (1994-11-01), Oomachi et al.
Research Disclosure No. 340, Aug. 1992, Emsworth, GB, "Circuit Fabrication Process".
Research Disclosure No. 312, Apr. 312, Apr. 1990, Emsworth, GB, "Laser Preparation of Epoxy Glass Composites for Electrolytic Metal Deposition".
Research Disclosure No. 326, Jun. 1991, Emsworth, GB, "PWB made by Laser Ablation of a Plastic Covered Substrate".
R. Baumann et al., "Local Electrical Conductivity in Poly(Bis-Alkylthio-Acetylene) Layers after Laser Irradiation," Synthetic Metals, 55-57, 1993, pp. 3643-3648.
Dippon Siegfrid
Lam Si-Ty
Olbrich Walter
Tamm Wilhelm
Weitmann Michael
Hewlett--Packard Company
Vo Peter
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