Electronic packaging apparatus

Details Electronic packaging apparatus Electronic packaging apparatus

1994-05-31

1996-03-12

Ro, Bentsu

Electricity: motive power systems

Positional servo systems

Program- or pattern-controlled systems

31856811, 318578, 29739, 29743, H05K 1304

Patent

active

054989426

ABSTRACT:
Electronic components such as chips are attracted to the tip ends of nozzles under suction, and mounted on printed-circuit boards when the vacuum condition in the nozzles is broken. The time for breaking the vacuum condition in the nozzles is adjusted by a variable time adjusting unit based on angular displacement information of a cam which vertically moves the nozzles depending on the selected mounting cycle. Even when a different mounting cycle is selected, time delays are varied to adjust the time for breaking the vacuum condition in the nozzles for thereby-mounting electronic components accurately and stably on printed-circuit boards.

REFERENCES:
patent: 3831250 (1974-08-01), Holiday
patent: 4231153 (1980-11-01), Browne
patent: 5033185 (1991-07-01), Hidese

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