Spiral grooved polishing pad for chemical-mechanical planarizati

Details Spiral grooved polishing pad for chemical-mechanical planarizati Spiral grooved polishing pad for chemical-mechanical planarizati

1996-02-23

1997-11-25

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451288, B24B 722

Patent

active

056905408

ABSTRACT:
The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers by placing a wafer against a polishing surface of the polishing pad while rotating the polishing pad about its center in the presence of a polishing slurry. The polishing surface has formed therein one or more grooves extending in a spiral inwardly from the periphery to the center of the polishing pad. As a result, slurry is transported inwardly toward the center or toward the periphery of the polishing pad depending upon the circumferential direction of the spiral relative to the direction of rotation of the polishing pad.

REFERENCES:
patent: 2762172 (1956-09-01), Franklin
patent: 5131190 (1992-07-01), Gougougyan
patent: 5177908 (1993-01-01), Tuttle
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5489233 (1996-02-01), Cook et al.

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