Bonding film member and mounting method of electronic component

Details Bonding film member and mounting method of electronic component Bonding film member and mounting method of electronic component

1994-06-22

1996-03-12

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437211, 437214, 437217, 437219, 437220, H01L 2160

Patent

active

054985757

ABSTRACT:
A method of mounting electronic components on circuit boards, which includes the steps of obtaining a bonding film member by filling bonding material into openings in a predetermined pattern of an electrically-insulating and heat-proof film and holding the bonding material in the openings by a flux layer laminated on one surface of the film, overlaying the bonding material of the bonding film member onto conductive layers of a circuit board by supplying the bonding film member onto the circuit board, superposing electrodes of electronic components onto the bonding material of the bonding film member by supplying the electronic components onto the bonding film member, and melting the bonding material by heating the circuit board.

REFERENCES:
patent: 4839713 (1989-06-01), Teraoka et al.
patent: 4927491 (1990-05-01), Masaki
patent: 4990462 (1991-02-01), Sliwa, Jr.
patent: 5053357 (1991-10-01), Lin et al.
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5303120 (1994-04-01), Michii et al.
patent: 5309021 (1994-05-01), Shimamoto et al.

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