Method and apparatus for plating a substrate

Details Method and apparatus for plating a substrate Method and apparatus for plating a substrate

1998-09-16

2000-09-26

Dudash, Diana

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, B05D 512

Patent

active

061239844

ABSTRACT:
A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the fine cavities with plating solution. The method comprises disposing the substrate in a hermetic chamber, filling the chamber with a treatment medium which is liquid at normal temperature and pressure, maintaining the treatment medium within the chamber at a subcritical or supercritical state. The treatment medium within the chamber is finally converted into liquid phase without passing through a vapor phase by controlling pressure and temperature within the chamber so as to infiltrate the treatment medium into the fine cavities.

REFERENCES:
patent: 5403621 (1995-04-01), Jackson et al.

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