Thermoplastic polymer compositions containing high molecular wei

Details Thermoplastic polymer compositions containing high molecular wei Thermoplastic polymer compositions containing high molecular wei

1991-11-21

1994-04-12

Seidleck, James J.

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

428364, 428412, 4284735, 4284744, 428480, 428523, 428 3692, 525132, 525146, 525165, 525178, 525185, B29D 2200, B32B 2730, B32B 2734, B32B 2736

Patent

active

053024290

ABSTRACT:
Vinyl aromatic polymers having a minimum molecular weight of about 500,000, and preferably of about 1,500,000, are blended at levels of from about 1 to about 25% with thermoplastic resins to improve the melt rheology of the thermoplastic resins and facilitate blow molding, thermoforming, extrusion and similar processes.

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