Method for obtaining via patterns in ceramic sheets

Details Method for obtaining via patterns in ceramic sheets Method for obtaining via patterns in ceramic sheets

1991-04-03

1994-04-12

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156246, 264 61, 427 96, B32B 1800

Patent

active

053022190

ABSTRACT:
A process for producing via patterns in a ceramic sheet which includes the steps of forming an array of vias and then selectively filling in at least a portion of the vias with a non-conductive filler material, such as a ceramic, to create a custom via pattern. The process is particularly useful for fabricating grid transformers and ceramic printed circuit boards. The present invention also relates to ceramic devices produced by the process, and a universal tool adapted for carrying out the process.

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patent: 5011725 (1991-04-01), Foster

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