Metal fusion bonding – Process – Preplacing solid filler
Patent
1994-09-01
1996-03-12
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
228255, 228 563, B23K 308
Patent
active
054979382
ABSTRACT:
A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms may be shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.
REFERENCES:
patent: 3472365 (1969-10-01), Tiedma
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4216350 (1980-08-01), Reid
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5388327 (1995-02-01), Trabucco
A sales brochure from Nitto Denko regarding ASMAT.
Pub No. 05-136,142, Anon. Abstract of JP-5136142, Jun. 1, 1993.
Pub No. 04-368,142, Anon. Abstract of JP-4368142, Dec. 21, 1992.
Anon. 009859265, WPI Acc No.: 94-139122/17, Description of JP doc., Mar. 25, 1994.
IBM Technical Disclosure Bulletin, Bump Tape Connector, vol. 36, No. 09B, pp. 553,554, Sep. 1993.
Chiu George
McMahon John F.
Heinrich Samuel M.
Intel Corporation
LandOfFree
Tape with solder forms and methods for transferring solder to ch does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape with solder forms and methods for transferring solder to ch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape with solder forms and methods for transferring solder to ch will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2095468