Thermoplastic polyamide moulding material having reduced water u

Details Thermoplastic polyamide moulding material having reduced water u Thermoplastic polyamide moulding material having reduced water u

1987-08-05

1988-08-30

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524101, 525430, C08G 6946

Patent

active

047678119

ABSTRACT:
Thermoplastic polyamide molding materials having reduced water uptake are obtained by the addition of 0.3-15% by weight, based on the polyamide, of an epoxide compound containing at least one oxirane group of general formula I ##STR1## in which R.sub.1 is hydrogen, alkyl, aralkyl or aryl, and R.sub.2 is hydrogen, alkyl, dialkyl, aryl, or a group of general formula II

REFERENCES:
patent: 3498953 (1970-03-01), Glfers
patent: 3699183 (1972-10-01), Hermann et al.
patent: 4071486 (1978-01-01), Parker
patent: 4383065 (1983-05-01), Woo et al.

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