Electrical connections for chip carriers

Geometrical instruments

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39176MP, H01R 1312

Patent

active

041165195

ABSTRACT:
Packaging and interconnecting means for a plurality of microcircuit chips contained in chip carriers comprises a chip carrier socket which is dimensioned to receive a plurality of chip carriers in stacked relationship, one on top of the other. Vertically extending conductors in the socket are contacted by the leads from the chip carriers. In accordance with one embodiment, the several chip carriers are electrically and physically identical and the conductors are shared by all of the chips, excepting one dedicated conductor for each chip carrier. Alternatively, the chips in the chip carriers can be electrically dissimilar in which case only limited numbers of the socket conductors are shared and connections among the several chip carriers in the stack are achieved by interrupting the conductors in the chip carrier socket.

REFERENCES:
patent: 3701077 (1972-10-01), Kelly, Jr.
patent: 3715629 (1973-02-01), Swengel, Sr.
patent: 3912984 (1975-10-01), Lockhart, Jr. et al.
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4028722 (1977-06-01), Helda
patent: 4045105 (1977-08-01), Lee et al.
Aviation Week & Space Technology, Klass, 1-1977, pp. 49-51.

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