High mix printed circuit assembly technique

Details High mix printed circuit assembly technique High mix printed circuit assembly technique

1990-09-28

1992-12-15

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

364468, 364469, 364480, 414223, 414224, 414786, 901 6, H05K 330

Patent

active

051705540

ABSTRACT:
A technique for efficient use of component placement apparatus used for assembling many different printed circuit boards, wherein all of the printed circuit boards are collectively comprised of more parts than can be handled by a single setup. A portion of the apparatus is dedicated to producing a first family of boards whose identity is determined by their high volume as well as by their parts overlap, while another portion is periodically changed in order to optionally produce different families of boards characterized by their lower volume and lower parts overlap. The changed setups required for the different families of boards are accomplished off-line while the first family of boards is in on-line production.

REFERENCES:
patent: 4651863 (1987-03-01), Reuter et al.
patent: 4694570 (1987-09-01), Rudolph et al.
patent: 4706187 (1987-11-01), Arai et al.
patent: 5007162 (1991-04-01), Weeber
IBM Tech Disclosure Bulletin vol. 30 No. 10 Mar. 1988 pp. 43-45.

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