Patent
1983-09-12
1985-02-05
James, Andrew J.
357 15, 357 52, 357 65, 357 68, 29589, H01L 2348, H01L 2934, H01L 2948
Patent
active
044980965
ABSTRACT:
An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.
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Ahn et al., "Permalloy Solder Barrier for Devices with Gold Metallization", IBM Tech. Discl. Bull., vol. 20, No. 12, p. 5317, May 1978.
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Addie David L.
Ellsworth Kenneth A.
Handy Robert M.
James Andrew J.
Lamont John
Motorola Inc.
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