Solder substrate clip

Geometrical instruments

Patent

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Details

H01R 906

Patent

active

040198030

ABSTRACT:
A solder substrate clip having a contact arm, a mass of solder secured to the arm on a side away from a contact surface and a solder globule integral with the mass of solder at an edge of the arm extending from the mass across the edge of the arm to the contact surface for engagement with a contact pad on the substrate.

REFERENCES:
patent: 3351704 (1967-11-01), Sitzler
patent: 3750252 (1973-08-01), Landman
patent: 3750265 (1973-08-01), Cushman
patent: 3889364 (1975-06-01), Krueger
patent: 3953102 (1976-04-01), Rivetta et al.

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