Solder ball mounting apparatus and method

Details Solder ball mounting apparatus and method Solder ball mounting apparatus and method

1999-06-22

2000-12-12

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 62, 228 9, 228 41, 228 45, B23K 120, B23K 3102

Patent

active

061586498

ABSTRACT:
By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.

REFERENCES:
patent: 5386623 (1995-02-01), Okamoto et al.
patent: 5415679 (1995-05-01), Wallace
patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5626277 (1997-05-01), Kawada
patent: 5902495 (1999-05-01), Burke et al.
patent: 5976965 (1999-02-01), Takahashi et al.
patent: 5983490 (1999-11-01), Sakemi

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