Epoxy resin compositions for encapsulating signal transmission d

Details Epoxy resin compositions for encapsulating signal transmission d Epoxy resin compositions for encapsulating signal transmission d

1996-05-30

1997-12-16

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528 92, 528110, 528122, 5282955, 528411, C08L 6308, C08L 6300, C08G 5900, C08G 6528

Patent

active

056986319

ABSTRACT:
A room-temperature curable composition useful for encapsulating transmission signal devices, comprising:
(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;
(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and
(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds. The composition is useful for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks.

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Lee et al., "Handbook of Epoxy Resins", McGraw-Hill Book Co., pp. 11/2-11/8 (Reissue 1982).

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