Mechanical bonding of metal method

Details Mechanical bonding of metal method Mechanical bonding of metal method

1980-11-26

1982-09-21

Moon, Charlie T.

Metal working

Method of mechanical manufacture

Assembling or joining

29521, 403282, B23P 300, B23P 2500, B23P 1100

Patent

active

043499546

ABSTRACT:
This invention is directed to a method of joining the surfaces of two metal structures in a mechanical bond. The joining process can be performed in either art or vacuum. The metal surfaces of the structures 10 and 12 that are to be bonded are exposed to an ion beam 14 together with a target 18 of low sputtering yield material. This material deposits on the surfaces and creates sites of sputter resistance which evolve into peaks 20 of a cone like surface microstructure. The textured metal surfaces are arranged in face to face relationship and compressed together with plastic deformation which mechanically interlocks the cone 22. A large interface area is produced which minimizes thermal and electrical losses. Also, no electrical power or heat is required during metal joining.

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patent: 3666642 (1972-05-01), Alwan et al.
patent: 3699334 (1973-10-01), Cohen et al.

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