Electrodeposition of coatings on metals to enhance adhesive bond

Chemistry: electrical and wave energy – Processes and products

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204181R, C25D 904, C25D 906

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active

041804422

ABSTRACT:
The invention is directed to the electrodeposition of a coating of an organic compound or polymer on a metal such as aluminum, and the formation of a chemical bond between the metal and the coating. In the method for electrolytically depositing such coating on the metal substrate, e.g. aluminum, the substrate is employed as the anode in a non-aqueous electrolyte containing a coating compound, preferably a carboxyl-substituted aminosilane such as .gamma.-aminopropyltriethoxysilane, which has been reacted with any of various anhydrides such as phthalic, maleic, or succinic anhydride, and electrodepositing a coating on the metal substrate, the organic coating formed being chemically bonded to the substrate, thereby enhancing adhesive bonding to the metal substrate or enhancing spot weldability of such substrate, such coating being strongly bonded to the substrate and being corrosion resistant.

REFERENCES:
patent: 3697398 (1972-10-01), Wessling
patent: 3720589 (1973-03-01), Masunaga et al.
patent: 3734784 (1973-05-01), Bereday et al.
patent: 3790450 (1974-02-01), Bloch et al.
patent: 3990953 (1976-11-01), Austin

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