Substrate supported three-dimensional micro-coil

Details Substrate supported three-dimensional micro-coil Substrate supported three-dimensional micro-coil

Filed on

1999-03-04

Date issued

2000-11-14

Examiner

Gellner, Michael L.

Patent Class

Inductor devices

SubClass

Coil or coil turn supports or spacers

SubSubClass

Printed circuit-type coil

Other Related Categories

336233, 336232, H01F 500, H01F 2728

Type

Patent

Status

active

Patent number

061475823

Description

ABSTRACT:
A method of forming a three-dimensional micro-coil on a substrate (10) is provided which consists of forming a first metal layer (14) on the substrate (10). The first metal layer (14) is partitioned into a first plurality of metal strips (16). A sacrificial layer (18) is formed on the first plurality of metal strips (16). A second metal layer (24) is formed on the sacrificial layer (18). The second metal layer (24) is then partitioned into a second plurality of metal strips (26) such that a continuous loop of metal is formed between the first plurality of metal strips (16) and the second plurality of metal strips (26). This continuous loop of metal defines windings for a three-dimensional micro-coil (28) with one side in contact with the substrate (10).

REFERENCES:
patent: 5425167 (1995-06-01), Shiga et al.
patent: 5450755 (1995-09-01), Saito et al.
patent: 5477204 (1995-12-01), Li
Ahn et al, "A Fully Integrated Planar Toroidal Inductor with a Micromachined Nicke-Iron Magnetic Bar", IEEE Transaction on Components, packaging, and manufacturing Technology- Part A, vol. 17, No. 3, Sep. 1994.
Senda et al, "High frequency measurement technique for patterned soft magnetic film ppermeability with magnetic film/conductor/magnetic film inductance line", American Institute of Physics, pp. 1034-1037, Apr. 1993.

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