Carrier structure integral with an electronic package and method

Details Carrier structure integral with an electronic package and method Carrier structure integral with an electronic package and method

1978-05-04

1979-12-25

Dixson, Jr., William T.

Special receptacle or package

For a building component

Shingle

174 52FP, B65D 8106, B65D 8530, B65D 7522

Patent

active

041801610

ABSTRACT:
A carrier structure for electronic components which allows safe handling, testing, marking and shipment is fabricated as an integral part of the electronic component package. The carrier forms a square protective enclosure surrounding the electronic device and connected to the electronic device by breakable plastic tabs which are molded with the electronics component package. The structure allows the electrical leads of the electronic component to be trimmed, formed, and tested while the component is still attached to the carrier.

REFERENCES:
patent: 3606000 (1971-09-01), Wise
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3858721 (1975-01-01), Boyer et al.
patent: 3938657 (1976-02-01), David

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