Multi-layered circuit substrate

Details Multi-layered circuit substrate Multi-layered circuit substrate

1997-12-16

2000-06-13

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 174255, 174257, 174258, 174261, 174262, 174263, 174264, 174265, 430 14, B32B 300, H05K 103

Patent

active

060747285

ABSTRACT:
A multi-layered circuit substrate and a manufacturing method thereof comprising the steps of coating the upper surface of a substrate with a photosensitive insulating layer; exposing and developing the photosensitive insulating layer to form a photosensitive insulating layer of predetermined pattern and pattern spaces; forming a conductive layer by printing a conductive ink in the pattern spaces; and forming a plurality of layers by performing the previous steps, each layer comprising a photosensitive insulating layer of predetermined pattern and pattern spaces and a conductive layer formed in the pattern spaces. The method further comprises the steps of coating an uppermost layer of the plurality of layers with an adhesive insulating layer, forming a metallic thin-film on the adhesive insulating layer by thermal pressing; etching the metallic thin-film to form a predetermined pattern of a metallic thin film; and forming a through hole into which a conductive material is implanted, the through hole penetrating the substrate, conductive layer, photosensitive insulating layer and metallic thin-film so to electrically connect the conductive layer to the patterned metallic thin-film.

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patent: 5599595 (1997-02-01), McGinley et al.
patent: 5798563 (1998-08-01), Feilchenfeld et al.
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