Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1997-06-18
1999-02-16
Karlsen, Ernest F.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
G01R 3500
Patent
active
058724494
ABSTRACT:
A multi-sided, integrated circuit die includes a plurality of read only memory (ROM) circuits, positioned only at the corners of the die, to simplify qualification testing of new package designs. During qualification testing, electrical and environmental stresses are applied to the package and die combination. The package and die are electronically evaluated at predetermined intervals to determine whether a failure has occurred during testing. When a failure occurs during testing, the package and die are diagnosed to isolate and determine the cause or source of the failure. Package design parameters are adjusted accordingly to reduce or eliminate the occurrence of the failures. An optional 12-bit counter is fabricated onto the die for each ROM circuit to exercise the ROM during qualification testing. An optional process monitor is also fabricated onto the die for each ROM circuit to determine the strength of the fabrication process and the resulting quality of circuit elements produced therefrom.
REFERENCES:
patent: 4243937 (1981-01-01), Multani et al.
patent: 4684884 (1987-08-01), Soderlund
patent: 4933635 (1990-06-01), Deutsch et al.
patent: 5068547 (1991-11-01), Gascoyne
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5262719 (1993-11-01), Magdo
patent: 5289113 (1994-02-01), Meaney et al.
patent: 5414351 (1995-05-01), Hsu et al.
patent: 5468541 (1995-11-01), Hsu
patent: 5477160 (1995-12-01), Love
patent: 5570035 (1996-10-01), Dukes et al.
Chu Wei-Mun
Gouravaram Sudhakar
Tran Huy
Karlsen Ernest F.
LSI Logic Corporation
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