Metal fusion bonding – Process – Applying or distributing fused filler
Patent
1998-05-21
2000-06-13
Ryan, Patrick
Metal fusion bonding
Process
Applying or distributing fused filler
228262, 2281791, 2281115, 428383, B23K 3102, B23K 3512, B32B 2700, D02G 300
Patent
active
060738324
ABSTRACT:
Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.
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Newsome Cecilia
Ryan Patrick
Tamagawa Seiki Kabushiki Kaisha
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