Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-10-21
2000-11-14
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156330, 228175, 523442, 523459, B32B 3100
Patent
active
061464880
ABSTRACT:
The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.
REFERENCES:
patent: 2510727 (1950-06-01), Sussenbach
patent: 3972111 (1976-08-01), Dash
patent: 4654382 (1987-03-01), Hiza et al.
patent: 5240645 (1993-08-01), Strecker
Okada Toshiya
Okita Tomiharu
Okuri Yasuhiro
Yamashita Kiichi
Furukawa Electric Co. Ltd.
Gallagher John J.
Sunstar Giken Kabushikikaisha
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