Flexible laminate for flexible circuit

Details Flexible laminate for flexible circuit Flexible laminate for flexible circuit

1999-03-12

2000-11-14

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562726, 1562739, 1562755, 1562757, 29830, 428 418, 4284735, 428901, B32B 3124

Patent

active

061464805

ABSTRACT:
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.

REFERENCES:
patent: 3985604 (1976-10-01), Balla
patent: 4337279 (1982-06-01), Polak
patent: 4863808 (1989-09-01), Sallo
patent: 5130192 (1992-07-01), Takabayashi et al. et al.
patent: 5242562 (1993-09-01), Beyerle et al.
patent: 5473118 (1995-12-01), Fukutake et al.
patent: 5589280 (1996-12-01), Gibbons et al.
patent: 5681443 (1997-10-01), Ameen et al.
U.S. application No. 09/266,951, Tad Bergstresser et al. filed Mar. 12, 1999, entitled: Laminate for Multi-Layer Printed Circuit.

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