Workpiece chuck

Details Workpiece chuck Workpiece chuck

1997-12-31

2000-06-13

Leo, Leonard

Heat exchange

With retainer for removable article

165 802, 165 82, 165185, 118728, 269 21, 269903, F28F 700, B25B 1100

Patent

active

06073681&

ABSTRACT:
A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

REFERENCES:
patent: 4607220 (1986-08-01), Hollman
patent: 4682857 (1987-07-01), Tan
patent: 4734872 (1988-03-01), Eager et al.
patent: 4781244 (1988-11-01), Kuramitsu et al.
patent: 4893914 (1990-01-01), Hancock et al.
patent: 5033538 (1991-07-01), Wagner et al.
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5281794 (1994-01-01), Uehara et al.
patent: 5567267 (1996-10-01), Kazama et al.
patent: 5578532 (1996-11-01), Van De Ven et al.
patent: 5610529 (1997-03-01), Schwindt
patent: 5738165 (1998-04-01), Imai

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