Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Electrical therapeutic systems
Patent
1998-08-27
1999-02-16
Kamm, William E.
Surgery: light, thermal, and electrical application
Light, thermal, and electrical application
Electrical therapeutic systems
29515, A61N 1375
Patent
active
058715150
ABSTRACT:
A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature formed on or in the tab that is designed to accommodate the flow of the thermoplastic material during the application of ultrasonic energy in the region of the tab channel and to cooperate with the solidified mass of thermoplastic material. During application of the ultrasonic energy, the thermoplastic material melts and flows into the remaining space of the tab channel and encapsulate the attachment tab including the retention feature. Upon termination of the ultrasonic energy, the thermoplastic housing material cools and solidifies and forms a continuous mass that encapsulates the surface of the attachment tab and the retention feature.
REFERENCES:
patent: 3842842 (1974-10-01), Kenney et al.
patent: 4041956 (1977-08-01), Purdy et al.
patent: 4142532 (1979-03-01), Ware
patent: 4182345 (1980-01-01), Grose
patent: 4243042 (1981-01-01), Ware
patent: 4248237 (1981-02-01), Kenney
patent: 4314562 (1982-02-01), Ware
patent: 5070605 (1991-12-01), Daglow et al.
patent: 5086773 (1992-02-01), Ware
patent: 5207218 (1993-05-01), Carpentier et al.
patent: 5431695 (1995-07-01), Wiklund et al.
patent: 5456698 (1995-10-01), Byland et al.
patent: 5522861 (1996-06-01), Sikorski et al.
patent: 5535097 (1996-07-01), Ruben et al.
patent: 5755743 (1998-05-01), Volz et al.
"Ultrasonic Molding of Plastic Powders" Satinder Nayer, Avraham Benatar, The Ohio State University, Design and Manufacutring of Advanced Composites, Dearborn, Michigan USA Sep. 25-28, 1989.
"Three New Ways to Fabricate Plastics--Ultrasonically", Corporate Sourece: Branson Sonic Power Co., Sourece: Plast.Technol.; 24 No.9, Aug. 1978, pp. 37-39; Journal Announcement: 7812 Rapra Update: 8201.
"Ultrasonic Pressing of Plastic-Film Capacitor", Kaneko, Seiji, Zhu, Weihong, Gakumazawa, Masahide, Sinoda, Kiyoshi, Corporate Sourece: Shibaura Inst. of Technology, Tokyo, Japan; Converence Title: Proceedings of the Ultrasonics International Conference; Conference Location: Vienna, Austria.
Ultrasonic Joining of Moulded Parts and Simi-Finished Parts of Thermo-Plastic Polymers in Mass Production: Forming with Ultrasound, Staking, Swaging and Tamping (Guideline DVS 2216, Part 3, 1992); Source: Welding in the World, Le Soudage Dams le Monde v 31 n 3 1993, pp. 205-207.
"Ultrasonic Assist in Drilling of Metals and in Molding of Polymer Powders", H.V. Fairbinks, Corporate Sourece: Wva University, Morgantown; Source: Proceedings of the International Conference on Production Engingeering, 27th, New Delhi, India, Aug. 27 through Sep. 4, 1977; Published by Institute of Eng. (India), Calcutta, 1977, v.2, p. 5, Publication Year 1977.
Haeg Daniel C.
Kelley James F.
Wiklund Craig L.
Evanisko George R.
Kamm William E.
Medtronic Inc.
Patton Harold R.
Woods Thomas F.
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