Method and apparatus for coating of circuit boards

Details Method and apparatus for coating of circuit boards Method and apparatus for coating of circuit boards

1986-01-21

1987-09-22

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118324, 118314, 118304, 118680, 118681, 118682, 118683, 118676, B05D 512

Patent

active

046954821

ABSTRACT:
Method and apparatus for applying a flow of insulating material such as silicone to predetermined locations on printed circuit boards to avoid damaging the components on the circuit boards, such as solenoids and buzzers, whose functions will be impaired by the application of such material thereto. The apparatus is comprised of a pump which delivers a flow of insulating material to a manifold, the manifold having a plurality of lengths of flexible tubing attached thereto which serve as nozzles for dispensing the flow of insulating material. A printed circuit board is mounted on a conveyor and the conveyor is advanced until the printed circuit board is under the manifold, at which time the manifold is lowered to place the nozzles in close proximity to the printed circuit board so that the flow of insulating material will be directed to predetermined locations on the printed circuit board. The flexible nozzles are selectively positioned to direct the flow to those predetermined locations. A wave coating apparatus is provided to coat the bottom of the printed circuit board.

REFERENCES:
patent: 3565319 (1971-02-01), Eschenbrucher
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4454003 (1984-06-01), Fishman
patent: 4488505 (1984-12-01), Schaming
patent: 4493286 (1985-01-01), Carson
patent: 4560584 (1985-12-01), Henninger
Technical Devices Company Mark I Model B Wave Soldering Machine brochure.

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