Planarization of a layer of metal and anodic aluminum

Details Planarization of a layer of metal and anodic aluminum Planarization of a layer of metal and anodic aluminum

1986-11-13

1987-07-21

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

046816666

ABSTRACT:
A planarization method of fabricating a layer of metal conductors embedded in a dielectric level. A coating of aluminum is anodized from the top but leaving a thickness of unanodized aluminum on the bottom. The top is masked and etched to provide a predetermined bare area which is etched out down to the unanodized aluminum. A metal is plated to the unanodized aluminum equal to the thickness of the unexposed anodic aluminum. The mask is removed and the unanodized aluminum is anodized. Therefore, the layer of metal and the dielectric anodic aluminum are planarized. Another anodizable metal may be used as an undercoat layer for completing the anodizing of the aluminum.

REFERENCES:
patent: 4499119 (1985-02-01), Smith

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