Insulating paste and thick-film multi-layered printed circuit us

Details Insulating paste and thick-film multi-layered printed circuit us Insulating paste and thick-film multi-layered printed circuit us

1997-10-22

1999-10-19

Jones, Deborah

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 15, 501 20, 501 21, 501 65, 501 66, 428210, C03C 814, C03C 816

Patent

active

059688580

ABSTRACT:
An insulating paste comprises a glass component composed of SiO.sub.2, B.sub.2 O.sub.3 and K.sub.2 O as xSiO.sub.2 -yB.sub.2 O.sub.3 -zK.sub.2 O, where x, y and z (% by weight) fall within the area surrounded by points A (x=65, y=35, z=0), B (x=65, y=20, z=15), C (x=85, y=0, z=15) and D (x=85, y=15, z=0), and an organic vehicle. The insulating layer made of the paste has a low dielectric constant and excellent insulating properties.

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patent: 5702996 (1997-12-01), Kawakami et al.
patent: 5710082 (1998-01-01), Kawakami et al.
patent: 5747395 (1998-05-01), Smith et al.

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